发明名称 MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD APPARATUS HAVING THE CAPACITOR
摘要 <p>PURPOSE: A multilayer chip capacitor and a circuit board apparatus having the capacitor are provided to form the stable electric power distribution networks. CONSTITUTION: The length of the first and the second inner electrode(121',122') is reduced. In that way the area of the overlap domain(OL1) between the first and second inner electrodes having the different polarity diminishes. The capacitance of the first capacitor part(CR1) diminishes according to the reduction of the area of the overlap domain. The area of the overlap domain of the first inner electrode and the second inner electrode is smaller than the area of the overlap domain(OL2) of the third inner electrode(123) and fourth inner electrode(124). By reducing the capacitance of the first capacitor part, high ESR and the flat impedance characteristic are easily obtained.</p>
申请公布号 KR20100020717(A) 申请公布日期 2010.02.23
申请号 KR20080079442 申请日期 2008.08.13
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, BYOUNG HWA;WI, SUNG KWON;CHUNG, HAE SUK;PARK, DONG SEOK;PARK, SANG SOO;PARK, MIN CHEOL
分类号 H01G4/30;H01G4/33 主分类号 H01G4/30
代理机构 代理人
主权项
地址