发明名称 Integration circuits for reducing electromigration effect
摘要 An integrated circuit for reducing the electromigration effect. The IC includes a substrate and a power transistor which has first and second source/drain regions. The IC further includes first, second, and third electrically conductive line segments being (i) directly above the first source/drain region and (ii) electrically coupled to the first source/drain region through first contact regions and second contact regions, respectively. The first and second electrically conductive line segments (i) reside in a first interconnect layer of the integrated circuit and (ii) run in the reference direction. The IC further includes an electrically conductive line being (i) directly above the first source/drain region, (ii) electrically coupled to the first and second electrically conductive line segments through a first via and a second via, respectively, (iii) resides in a second interconnect layer of the integrated circuit, and (iv) runs in the reference direction.
申请公布号 US7667328(B2) 申请公布日期 2010.02.23
申请号 US20070680081 申请日期 2007.02.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 STAMPER ANTHONY KENDALL;SULLIVAN TIMOTHY DOOLING;WANG PING-CHUAN
分类号 H01L23/528 主分类号 H01L23/528
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