发明名称 Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof
摘要 A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.
申请公布号 US7666715(B2) 申请公布日期 2010.02.23
申请号 US20040578854 申请日期 2004.12.14
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 BRUNNER HERBERT;JAEGER HARALD;SORG JOERG ERICH
分类号 H01L23/31;H01L31/0203;H01L31/18;H01L33/48;H01L33/50;H01L33/56;H01L33/62 主分类号 H01L23/31
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