发明名称 Pattern evaluation method, method of manufacturing semiconductor, program and pattern evaluation apparatus
摘要 A pattern evaluation method includes: acquiring an image of a pattern to be evaluated, detecting edge points of the pattern from the image, creating a parameter curve having the detected edge points as control points thereof, and evaluating the pattern based on the created parameter curve.
申请公布号 US7668373(B2) 申请公布日期 2010.02.23
申请号 US20050192043 申请日期 2005.07.29
申请人 发明人 MITSUI TADASHI
分类号 G06K9/00 主分类号 G06K9/00
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