THREE DIMENSIONAL PACKAGE OF ULTRA-THIN MEMS CHIP AND IC CHIP

摘要

PURPOSE: A three dimensional package of an ultra-thin MEMS chip and an IC chip are provided to connect conductive via and the conductive material formed on each via by manufacturing the thickness of a single chip to be thin. CONSTITUTION: A three dimensional package of a thin IC chip and MEMS chip includes at least two thin IC hip and MEMS chip. At least, two thin film integrated circuit chips are perpendicularly laminated. The thin film MEMS chip is laminated on one among thin film integrated circuit chips. A circuit is formed on the thin film integrated circuit chips. A conductive via passing through the thin film is formed to transmit a signal and power between IC chips or the thin film MEMS chip. The conductive material is used in order to interlink the conductive via and the circuit or the MEMS chip.