发明名称 FABRICATION METHOD OF MICRO ELECTRO-MECHANICAL COMPONENT
摘要 <p>PURPOSE: A fabrication method of micro electro-mechanical components is provided to omit a seed layer formation process by applying a plating process on a conductor substrate such as metal. CONSTITUTION: A conductor substrate(11) is composed of a substrate spread with metal itself and the conductive material like metal. A functional structure(12) performing an electromechanical is formed by processing the conductor substrate. The functional structure a functional unit(12a), a connection unit(12c) and 2 supporting unit(12b). A plating structures(14,15) are formed by using a plating method at the upper and lower parts of the functional structure.</p>
申请公布号 KR20100020292(A) 申请公布日期 2010.02.22
申请号 KR20080079004 申请日期 2008.08.12
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO, YOUNG HO;KIM, YOON JI;PARK, HO JOON;OH, YOUNG SOO;SON, HEE JU;CHANG, BYEUNG GYU;KIM, SANG JIN
分类号 H01L21/66;G01R1/073 主分类号 H01L21/66
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