FABRICATION METHOD OF MICRO ELECTRO-MECHANICAL COMPONENT
摘要
<p>PURPOSE: A fabrication method of micro electro-mechanical components is provided to omit a seed layer formation process by applying a plating process on a conductor substrate such as metal. CONSTITUTION: A conductor substrate(11) is composed of a substrate spread with metal itself and the conductive material like metal. A functional structure(12) performing an electromechanical is formed by processing the conductor substrate. The functional structure a functional unit(12a), a connection unit(12c) and 2 supporting unit(12b). A plating structures(14,15) are formed by using a plating method at the upper and lower parts of the functional structure.</p>
申请公布号
KR20100020292(A)
申请公布日期
2010.02.22
申请号
KR20080079004
申请日期
2008.08.12
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
CHO, YOUNG HO;KIM, YOON JI;PARK, HO JOON;OH, YOUNG SOO;SON, HEE JU;CHANG, BYEUNG GYU;KIM, SANG JIN