发明名称 |
LIQUID EPOXY RESIN COMPOSITION FOR UNDERFILLING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
PURPOSE: A liquid epoxy resin composition for an underfilling semiconductor device is provided to be used for an underfilling semiconductor device requiring high reliability and excellent rework. CONSTITUTION: A liquid epoxy resin composition for an underfilling semiconductor device comprises an epoxy resin, a hardener and curing accelerator. The epoxy resin is a bisphenol-epoxy resin and the hardener is a thiol compound. The liquid epoxy resin composition further comprises one or more compounds selected from a phenoxy resin, an epoxy resin represented by chemical formula 1, and an epoxy resin represented by chemical formula 2.
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申请公布号 |
KR20100020355(A) |
申请公布日期 |
2010.02.22 |
申请号 |
KR20080079104 |
申请日期 |
2008.08.12 |
申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
LEE, JI YEON;KIM, JONG SUNG |
分类号 |
C08L63/02;C08K5/37;C08L61/06 |
主分类号 |
C08L63/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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