| 摘要 |
PURPOSE: A solder ball bumping unit and a wafer bumping apparatus comprising the same are provided to prevent element failure and increase processing efficiency by removing a cause of the contamination of a ball mask in a wafer bumping process. CONSTITUTION: A bumping unit attaches a solder ball to a plurality of bumping domains defined in the substrate. The solder ball bumping unit comprises a solder ball absorbing unit(140) and a rotating unit. The solder ball absorbing unit comprises a vacuum flow passage and a solder ball mounting groove corresponding to a plurality of the bumping domains. The vacuum flow passage is communicated with the solder ball mounting groove. The rotating unit rotates the solder ball absorbing unit.
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