发明名称 FILMY ADHESIVE FOR CIRCUIT CONNECTION
摘要 <p>A filmy adhesive for circuit connection that is interposed between circuit electrodes opposed to each other and that by heating and applying pressure to the circuit electrodes opposed to each other, attains electrical connection between the electrodes along the direction of pressure application, characterized in that the angle of contact of the adhesive after hardening with water is 90°or greater.</p>
申请公布号 KR20100020029(A) 申请公布日期 2010.02.19
申请号 KR20107000630 申请日期 2007.06.13
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 KOJIMA KAZUYOSHI;KOBAYASHI KOUJI;ARIFUKU MOTOHIRO
分类号 C09J7/02;C09J9/02;C09J163/00;H01R11/00 主分类号 C09J7/02
代理机构 代理人
主权项
地址