发明名称 ALLOY NANO PARTICLE OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANO PARTICLE
摘要 <p>PURPOSE: An alloy nano particle of Sn-Cu-Ag, preparation method thereof, and ink or paste using the alloy nano particle are provided to improve electric conductance and have low firing temperature. CONSTITUTION: A manufacturing method of an alloy nano particle comprises the following steps of: dissolving solvent tartrate and surfactant with solvent(S101); forming tin nano particle by adding reducing agent into the solution at 100~260°C(S102); and forming tin-copper alloy nano particle by adding copper compound into the solution with reducing agent(S103).</p>
申请公布号 KR20100019867(A) 申请公布日期 2010.02.19
申请号 KR20080078611 申请日期 2008.08.11
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, KWI JONG;LEE, HYUCK MO;SONG, HYUN JOON;JO, YUN HWAN;PARK, JI CHAN;BANG, JUNG UP;KIM, DONG HOON
分类号 B22F9/18;B22F1/00;B22F9/00;B22F9/24;B23K35/22;B23K35/26;C09D11/00;C09D11/52;C22C13/00;H01B1/22;H01B5/00;H01B13/00 主分类号 B22F9/18
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