发明名称 |
ALLOY NANO PARTICLE OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANO PARTICLE |
摘要 |
<p>PURPOSE: An alloy nano particle of Sn-Cu-Ag, preparation method thereof, and ink or paste using the alloy nano particle are provided to improve electric conductance and have low firing temperature. CONSTITUTION: A manufacturing method of an alloy nano particle comprises the following steps of: dissolving solvent tartrate and surfactant with solvent(S101); forming tin nano particle by adding reducing agent into the solution at 100~260°C(S102); and forming tin-copper alloy nano particle by adding copper compound into the solution with reducing agent(S103).</p> |
申请公布号 |
KR20100019867(A) |
申请公布日期 |
2010.02.19 |
申请号 |
KR20080078611 |
申请日期 |
2008.08.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, KWI JONG;LEE, HYUCK MO;SONG, HYUN JOON;JO, YUN HWAN;PARK, JI CHAN;BANG, JUNG UP;KIM, DONG HOON |
分类号 |
B22F9/18;B22F1/00;B22F9/00;B22F9/24;B23K35/22;B23K35/26;C09D11/00;C09D11/52;C22C13/00;H01B1/22;H01B5/00;H01B13/00 |
主分类号 |
B22F9/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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