POLYMER FOR FORMING INSULATING FILM, COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM, AND ELECTRONIC DEVICE HAVING INSULATING FILM

摘要

Disclosed are a polymer and a composition which are useful for forming an insulating film having low dielectric constant, high heat resistance and high mechanical strength. Also disclosed are an insulating film obtained from such a polymer or a composition, and an electronic device having such an insulating film. Specifically disclosed is a polymer for forming an insulating film, which is characterized by being obtained by polymerizing a reactive compound represented by the general formula (1) below. Also specifically disclosed is an insulating film obtained by using an insulating film-forming composition containing such a polymer. This insulating film has molecular pores having an average pore diameter of not less than 0.7 nm but not more than 5 nm, while having a dielectric constant not more than 2.3. Further specifically disclosed is an electronic device having such an insulating film. (In the formula, R, Rand Rmay be the same as or different from one another and each represents an organic group having a ring structure; X and Y may be the same as or different from each other and each represents an aromatic organic group having a reactive group; and n represents 0 or 1.)