| 摘要 |
<p>PURPOSE: A method for processing optical device wafer is provided to prevent the cracking of a light device wafer by welding the surface of a light device wafer with a protecting plate having high rigidity. CONSTITUTION: A laser beam is irradiated to a light device wafer(2) along a street. The surface of the light device wafer is welded with the surface of protecting plate(4) with high rigidity by a binder. The light device wafer is formed with compacted layer thickness of device by grinding the rear side of the light device wafer adhered in the protecting plate. The light device wafer is broken along the street having a breaking start point by applying external force to the light device wafer.</p> |
