| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that avoids contact/interference with an overcoat resin formed at a through electrode position and a substrate edge at a land portion while securing bonding reliability between a through electrode and an electrode pad. <P>SOLUTION: The semiconductor device includes a semiconductor substrate 2, an electrode pad 4 disposed on one surface side 2a of the semiconductor substrate 2, a through-hole 5 disposed from one surface side 2b to the other surface side 2a of the semiconductor substrate 2 and exposing part of the electrode pad 4, and a through electrode 8 disposed inside the through-hole 5 and electrically connected to the electrode pad 4. A junction portion 10 between the electrode pad 4 and through electrode 8 is disposed at a region, in a surface of the electrode pad 4, closer to the center of the semiconductor substrate 2 than to the center region of the surface of the electrode pad 4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
