COMPONENT CONFIGURED FOR BEING SUBJECTED TO HIGH THERMAL LOAD DURING OPERATION

摘要

A component configured for being subjected to a high thermal load during operation includes a wall structure with cooling channels adapted for handling a coolant flow. At least one first cooling channel is adapted to convey the coolant from a first portion of the component to a second portion of the component. At least one second cooling channel in the second portion is closed so that the coolant is at least substantially-prevented from entering the closed second cooling channel from a cooling channel in the first portion.