| 摘要 |
PURPOSE: A resin molding system for a semiconductor device and a resin molding method for the semiconductor device using the same are provided to measure the thickness of a semiconductor chip with high-resolution by using a line laser and a high resolution camera. CONSTITUTION: A semiconductor device(10) is fixed on a stage(110). A laser irradiator(120) is placed to oppose the semiconductor device on the stage, and radiates a line laser beam(LB) to a semiconductor chip(14). A camera(130) obtains an image of the line laser beam from the semiconductor chip. An operation process unit calculates the thickness of the semiconductor chip by operating the image data obtained from the camera. A calculation unit for a resin quantity calculates an amount of a resin for molding the semiconductor chip and wire based on the thickness of the semiconductor chip. A supply unit for the resin supplies the calculated amount of the resin.
|
