发明名称 |
SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLIANCE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device in which a dust absorption part is formed without increasing the number of manufacturing processes. <P>SOLUTION: A camera module 1 includes curable adhesive 10 applied on a support part of a transparent board 4 in a center holder 5. The curable adhesive 10 includes a curable region C where the curable adhesive applied on a mounting part of the transparent board 4 in the support part 11 is cured and a non-curable region S where the curable adhesive 10 applied on a peripheral part of the mounting part is not cured. The center holder 5 holds an optical structure 6 provided with a lens barrel 8 and a focus adjustment mechanism 9. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010041213(A) |
申请公布日期 |
2010.02.18 |
申请号 |
JP20080199839 |
申请日期 |
2008.08.01 |
申请人 |
SHARP CORP |
发明人 |
KARAKI SATORU;NISHIMURA HIDETOSHI |
分类号 |
H04N5/225;G03B17/02;H01L27/14;H04N5/335 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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