| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a compact semiconductor device in which the interference of the respective signals of first and second semiconductor chips is suppressed. <P>SOLUTION: A first semiconductor chip C1 is provided with a first pad. A second semiconductor chip C2 is provided in a manner that its first side may be close to the first semiconductor chip. The second semiconductor chip C2 includes a second pad that is provided at a position of which distance to a third side is small. A first wire B1S passes over the second semiconductor chip C2, crosses the first and second sides, and connects the first pad to a first lead LS through an area of the second semiconductor chip C2 while pinching the second pad between a third side and itself. A second lead LES is arranged in a manner to pinch a third side between the second pad and itself. A second wire B2E connects the second pad to the second lead LES. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
