SEMICONDUCTOR WAFER TSV-PROCESSING FILM, AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER USING THE FILM

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer TSV (through silicon via)-processing film which is an adhesive film for pasting a protective substrate plate on the wafer in the processing comprising the formation of a penetrating hole and forming a penetrated electrode at the semiconductor wafer, has good moisture resistance and heat resistance, is reduced in the amount of a gas formed in the heating time, and has also alkali resistance and acid resistance.

SOLUTION: This semiconductor wafer TSV-processing film includes a fluoropolyether rubber adhesive. Also, a semiconductor wafer TSV-processing film being peelably pasted on the one side surface of its supporting film is provided.

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