| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip transfer device and a chip transfer method, wherein reliability of transfer of a chip is satisfactory and there is not an influence of the shape of a substrate on the other side to which the chip is transferred. Ž<P>SOLUTION: The chip 21 such as a semiconductor element stuck on an adhesive sheet 22 is transferred to the side of the substrate 23. Only a pressing member 24 is moved in a direction separated from the chip 21 so as to change a state where the chip 21 is pressed against the transfer surface 23a of the substrate 23 with the pressing surface 24a of the pressing member 14 into a state where an eject pin 26 protrudes from the pressing surface 24a. Consequently, while the chip 21 is left on the substrate side, the adhesive sheet 22 sucked to the pressing surface 24a is peeled from the chip 21. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
