| 摘要 |
<P>PROBLEM TO BE SOLVED: To produce a hexagonal semiconductor chip by dicing with high throughput and with efficiency. Ž<P>SOLUTION: A method of manufacturing a semiconductor device for cutting a semiconductor wafer 10 includes the following steps of: producing a first semiconductor circuit in a plurality of first regions on the semiconductor wafer; producing a second semiconductor circuit including a test element group for inspecting the first semiconductor circuit in a second region; producing a plurality of rhombic middle chips 13 including one first region and two second regions by carrying out cutting on a plurality of first cutting lines X1 running in a predetermined direction and arranged with a predetermined space and carrying out cutting on a plurality of second cutting lines X2 crossing with the first cutting line by a predetermined angle θ and arranged with a predetermined space; and carrying out cutting on a plurality of third cutting lines X3 to separate each rhombic middle chip 13 into one hexagonal semiconductor chip 11 including the first region and two triangular semiconductor chips 12 including the second region. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
