| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is good in sensitivity, resolution, adhesion, resist shape and peeling properties after curing, and a photosensitive element and a method for manufacturing a printed wiring board which use the same. <P>SOLUTION: The photosensitive resin composition comprises (A) a binder polymer, (B) a photopolymerizable compound comprising a compound of formula (1), and (C) a photopolymerization initiator. In the formula (1), R<SP>1</SP>and R<SP>2</SP>denote H or methyl: R<SP>3</SP>denotes H or a monovalent organic group; R<SP>4</SP>denotes a substituted or non-nsubstituted cyclic hydrocarbon group; -(XO)- and -(OY)- denote a (poly)oxyethylene chain, a (poly)oxypropylene chain, or a block copolymer chain or a random copolymer chain of ethylene oxide and propylene oxide, the total number of oxyethylene groups contained in -(XO)- and -(OY)- is 2-40, and the total number of oxypropylene groups is 0-40. <P>COPYRIGHT: (C)2010,JPO&INPIT |
