发明名称 ELECTROLYTIC COPPER FOIL AND COPPER CLAD LAMINATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electrolytic copper foil having flexibility/bending ability equivalent to or better than that of rolled copper foil. <P>SOLUTION: The electrolytic copper foil is produced such that after thermal treatment is applied to the electrolytic copper foil so that the LMP value shown in formula 1 is 9,000 or more, the crystal structure shows a red or blue color tone of 80% or more with respect to a plane with EBSP analysis. Formula 1 is LMP=(T+273)*(20+Logt) [wherein, 20 represents a material constant of copper; T represents a temperature (°C), and t represents a time (Hr)]. The relative strength of the (331) plane with respect to that of the (111) plane is 15 or greater, in the X-ray diffraction of the electrolytic copper foil after the thermal treatment is applied. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010037654(A) 申请公布日期 2010.02.18
申请号 JP20090160836 申请日期 2009.07.07
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 SUZUKI YUJI;SAITO TAKAHIRO
分类号 C25D1/04;B32B15/08;C25D3/38;C25D7/06;H05K1/09 主分类号 C25D1/04
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