| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing metal gate structure on a wafer in real time, by utilizing a multilayer multi-step processing procedure and related multilayer/multi-input/multi-output (MLMIMO) models. SOLUTION: The method relates to wafer processing utilizing multilayer processing procedure including one or more measuring processes, one or more poly-etching (P-E) processes and one or more metal gate etching processes, and the multilayer/multi-input/multi-output (MLMIMO) model and library. The MLMIMO processing control utilizes modeling of behaviors interacting dynamically between multiple layers and/or multiple processing steps. The multiple layers and/or multiple processing steps can relate to manufacturing lines, grooves, vias, spacers, contacts, and gate structures to be manufactured by utilizing isotropic and/or anisotropic etching processes. COPYRIGHT: (C)2010,JPO&INPIT |
