| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film deposition method for a strip-of-paper-like substrate by which a film is deposited on both sides of a strip-of-paper-like substrate becoming an electronic component, and the film is uniformly deposited. Ž<P>SOLUTION: The method using a magnetron system sputtering apparatus, includes setting a substrate fixture with the strip-of-paper-like substrate fitted thereto into a substrate holder, and depositing the film simultaneously on both sides of the strip-of-paper-like substrate. In the method, the strip-of-paper-like substrate is installed so as to be in the range of 0±10° with respect to the normal line direction of a sputtering source, the substrate holder is rotated, negative pulse bias voltage is applied to the substrate, the negative pulse bias voltage is controlled to be in the range of 100 to 1,000 V, also, t-off/t-on as a ratio between the duration time of the power source off t-off and the duration of the power source on t-on is controlled to be in the range of 0.1≤t-off/t-on≤1, and the film is deposited simultaneously on both sides of the strip-of-paper-like substrate. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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