| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress moisture from outside in a semiconductor module packaged with a sealing resin. <P>SOLUTION: A semiconductor element 40 mounted on an insulating resin layer 30 formed on a wiring layer 20 is sealed with a sealing resin 50. In the wiring layer 20, a bump electrode 22 and a protruding part 80 protruding on the side of semiconductor element 40 are integrally formed respectively. The bump electrode 22 is electrically connected to an element electrode 42 of the semiconductor element 40 by penetrating the insulating resin layer 30. The protruding part 80 is so arranged as to enclose the semiconductor element 40 along four sides of the semiconductor element 40, and is embedded in the sealing resin 50 up to the position higher than the joint part between the bump electrode 22 and the element electrode 42. <P>COPYRIGHT: (C)2010,JPO&INPIT |
