| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a transparent cured resin pattern and coating film which have excellent heat resistance. <P>SOLUTION: The photosensitive resin composition comprises a compound (A) having one or more groups selected from the group consisting of allyl and methallyl groups, a compound (B) having two or more mercapto groups, a photopolymerization initiator (C) and an alkali-soluble resin (E). <P>COPYRIGHT: (C)2010,JPO&INPIT |
