发明名称 RESISTANCE CHANGE ELEMENT, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR MEMORY DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor memory device that forms a resistance part by a low forming voltage, and improves the reliability of a resistance change element and the other elements. <P>SOLUTION: A resistance change element RES has: a plurality of insulating parts INS1 and INS2 arranged in parallel between a first electrode EL1 and a second electrode EL2; and resistance parts R1 and R2 formed in at least one of the insulating parts INS1 and INS2 by forming, and having resistance values changing depending on a voltage applied to the first and second electrodes EL1 and EL2. The resistance parts R1 and R2 are formed in an insulating part with a lower breakdown voltage among the insulating parts INS1 and INS2. Accordingly, the resistance parts R1 and R2 can be formed by a low forming voltage. The forming voltage can be reduced, thereby the reliability of the resistance change element RES and the other elements can be improved. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010040665(A) 申请公布日期 2010.02.18
申请号 JP20080199954 申请日期 2008.08.01
申请人 FUJITSU MICROELECTRONICS LTD 发明人 NOSHIRO HIDEYUKI
分类号 H01L27/10;H01L45/00;H01L49/00 主分类号 H01L27/10
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