发明名称 ELECTRONIC COMPONENT COOLER
摘要 PROBLEM TO BE SOLVED: To increase an heat transfer amount by forming a refrigerant flow passage in a tube 2 in a vertical multi-stage form without increasing the number of components and complicating the manufacture in an electronic component cooler 1. SOLUTION: A first fin 11 is disposed in each refrigerant flow passage in the tube 2, by which the refrigerant flow passage in the tube 2 can be vertically divided to increase the number of stages of the refrigerant flow passage and a heat transfer area can be set for each stage of the refrigerant flow passage by a right and left partition wall 20. Therefore, the number of stages of the refrigerant flow passage in the tube 2 can be increased vertically by one and the heat transfer amount can be increased without increasing the number of components. The first fin 11 can be molded by extrusion and molding of the fin is not so complicated as that of a general corrugated fin which is molded by a roller or a press. Thus, the refrigerant flow passage in the tube 2 can be formed in a vertical multi-stage form to increase the heat transfer amount without complicating the manufacture. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010040870(A) 申请公布日期 2010.02.18
申请号 JP20080203480 申请日期 2008.08.06
申请人 DENSO CORP 发明人 SUGIMOTO NAOMI
分类号 H01L23/473 主分类号 H01L23/473
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