SOLDER POWDER AND SOLDER PASTE

摘要

PROBLEM TO BE SOLVED: To provide a solder powder and a solder paste, for suppressing heat sagging upon preheating in reflow. SOLUTION: The solder powder has a substantially globular shape and has a plurality of rugged parts over the entire surface, wherein an average surface roughness Ra measured by a scanning probe microscopy (SPM) is 18 to 100 nm. COPYRIGHT: (C)2010,JPO&INPIT