| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve high-efficiency heat control by securing miniaturization, and to provide robust mounting arrangement excelling in quake resistance. Ž<P>SOLUTION: This electronic apparatus is composed such that a thermally-conductive member 17 with a power unit 13 supported thereto is housed by mounting its leg parts 171 to a bottom face of a housing body 11 of an apparatus housing 10 provided with an air inlet 112 and an air outlet 113; a radiator 14 supported to a sidewall surface of the housing body 11 is stacked on top of it while being thermally coupled thereto; a board unit 15 is stacked on the radiator 14 while being thermally coupled thereto; and the power unit 13 and the board unit 15 are thermally controlled by the single radiator 14. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
