发明名称 METHOD OF INSPECTING SEMICONDUCTOR WAFER
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of performing highly reliable inspection by: correcting displacement depending upon inspection temperature when electric characteristics are inspected at predetermined inspection temperature; and bringing a stylus tip of a probe terminal into normal contact with an electrode of a semiconductor element. Ž<P>SOLUTION: A contact position between the stylus tip of the probe terminal and the electrode of the semiconductor element, which are displaced due to inspection temperature, is corrected to bring them into contact with each other. As a correction value used for the correction, a correction amount for correcting the contact position between the stylus tip and electrode is previously calculated and obtained based on the relation between inspection times and displacement amounts of the probe terminal depending upon inspection temperature. The obtained correction amount is used to correct the contact position between the stylus tip of the probe terminal and the electrode of the semiconductor element at every certain inspection time. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010040750(A) 申请公布日期 2010.02.18
申请号 JP20080201808 申请日期 2008.08.05
申请人 PANASONIC CORP 发明人 KAWAMURA KENSAKU
分类号 H01L21/66;G01R31/28 主分类号 H01L21/66
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