WAFER FOR HEAT TREAT FURNACE EVALUATION, HEAT TREATMENT FURNACE EVALUATION METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To highly sensitively and reliably evaluate troubles, such as, metal contamination on a wafer and epitaxial layer faults due to heat treatment, in recombination lifetime measurements. SOLUTION: The wafer for heat treatment furnace evaluation is a silicon wafer having a resistance ratio within a range of 100-10,000 Ωcm. A heat treat furnace evaluation method uses the wafer for heat treat furnace evaluation. A semiconductor waver manufacturing method is also provided. COPYRIGHT: (C)2010,JPO&INPIT