发明名称 |
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. At least one penetration hole extends from one surface of the semiconductor chip to an opposite surface of the semiconductor chip. A penetration electrode is situated inside the penetration hole without contacting a wall of the penetration hole. The penetration electrode has one end fixed to the one surface of the semiconductor chip and an opposite end protruding from the opposite surface of the semiconductor chip. A connection terminal is formed on the opposite end of the penetration electrode and electrically connected to the wiring board.
|
申请公布号 |
US2010038772(A1) |
申请公布日期 |
2010.02.18 |
申请号 |
US20090535751 |
申请日期 |
2009.08.05 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
TAGUCHI YUICHI;HIGASHI MITSUTOSHI;SHIRAISHI AKINORI;SAKAGUCHI HIDEAKI;SUNOHARA MASAHIRO |
分类号 |
H01L23/48;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|