SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, PORTABLE APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To contrive the simplification of a manufacturing step of a semiconductor device having a PoP structure.

SOLUTION: A first semiconductor module 100 is a semiconductor module arranged under a semiconductor device 10 having a package-on-package structure. The semiconductor module includes: an element mounting substrate 110 having electrode parts 140 and 142 on one main surface; a semiconductor element 120 mounted on one main surface side of the element mounting substrate 110; an insulating resin layer 160 provided in such a manner as to seal the semiconductor element 120 on one main surface side of the element mounting substrate 110; a wiring layer 170 provided on the insulating resin layer 160; and a bump electrode 180 that is integrally formed with the wiring layer 170 and electrically connected with the electrode part 142 through the insulating resin layer 160.

COPYRIGHT: (C)2010,JPO&INPIT