发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity, image contrast, adhesion and pattern formation, which has sufficiently excellent resolution, developability and dimensional accuracy at the same time. <P>SOLUTION: The photosensitive resin composition includes (A) a phenolic resin obtained by a copolymerization reaction including a compound represented by general formula (1) and an aldehyde compound and/or a ketone compound as starting compounds and (B) a 1, 2-quinonediazide compound. In the formula (1), X denotes C(-R<SP>1</SP>)(-R<SP>2</SP>), S, O or S(=O)<SB>2</SB>; and R<SP>1</SP>and R<SP>2</SP>each independently denote H, trifluoromethyl, substituted or unsubstituted 1-6C saturated alkyl, substituted or unsubstituted 1-6C unsaturated alkyl or substituted or unsubstituted phenyl. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010039214(A) 申请公布日期 2010.02.18
申请号 JP20080202239 申请日期 2008.08.05
申请人 HITACHI CHEM CO LTD 发明人 SAWABE MASARU;INOUE KEISUKE
分类号 G03F7/023;C08G8/20;C08K5/28;C08L61/00;G03F7/004;H01L21/027 主分类号 G03F7/023
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