发明名称 POSITIVE TYPE PHOTOSENSITIVE INSULATING RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive type photosensitive insulating resin composition of which the coating film is excellent in flowability when thermocompression-bonded, and capable of forming a cured film of satisfactory adhesiveness and tightness. <P>SOLUTION: This positive type photosensitive insulating resin composition contains a polymer (A) containing a structural unit (a1) expressed by formula (1), a structural unit (a2) of specified acrylate, and a structural unit (a3) having a phenolic hydroxyl group, wherein 1-50 mass% of structural unit (a1) is contained, a compound (B) having a quinone azide group, a crosslinking agent (C), and a solvent (D). R<SP>1</SP>and R<SP>2</SP>represent a phenylene group or -COO-, R<SP>3</SP>and R<SP>4</SP>represent independently a phenyl group, a 1-6C alkyl group or alkoxyl group, R<SP>5</SP>represents a 1-6C alkyl group, n is an integer of 0-3, and m is an integer of 1-10, in the formula (1). <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010039270(A) 申请公布日期 2010.02.18
申请号 JP20080202957 申请日期 2008.08.06
申请人 JSR CORP 发明人 UCHIDA TARO;ITO JUNJI
分类号 G03F7/075;C08F220/26;G03F7/004;G03F7/023;G03F7/085 主分类号 G03F7/075
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