| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip separation method capable of certainly separating a chip from an adhesive sheet, even when the chip is small in size or light in weight. SOLUTION: An adhesive sheet 33, to which a chip group 34 has been stuck, is held under a predetermined tension. Four pushing pins 32a are pushed against a surface of the adhesive sheet 33 opposite to the surface where the chip group 34 exists, to form upheavals UH on the surface of the adhesive sheet 33 where the chip group 34 exists. Further, each of pushing pins 32a is moved along an orbit OR1 so that the upheavals UH contact all of the chips 35 constituting the chip group 34. COPYRIGHT: (C)2010,JPO&INPIT |
