| 摘要 |
<P>PROBLEM TO BE SOLVED: To electrically connect circuit interconnections of multiple layers although graft polymerization plating interconnection technique is employed. Ž<P>SOLUTION: An intermediate layer 5 of a film thickness of a monomolecular film level is formed on the entire surface of a glass substrate 2 so as to enhance adhesive strength between a glass substrate 2 having an ITO layer 3 formed on its surface and a graft polymer layer 6. The graft polymer layer 6 is patterned so as to cover the ITO layer 3, and a Cu layer 6 is formed on a surface of the graft polymer layer 6 by plating processing. Although the intermediate layer 5 of the film thickness of monomolecular level is formed between the ITO layer 3 and CU layer 8, the film thickness of the intermediate layer 5 causes the intermediate film to lose its original insulation, and the ITO layer 3 and Cu layer 8 are electrically connected to each other. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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