| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a rise in temperature of an electronic component mounted on a substrate. Ž<P>SOLUTION: A heat-generating electronic component 22a is mounted on the upper surface of the circuit substrate 30, a low-heat-generating electronic component 22b on the lower surface of the circuit substrate 30 is disposed at a position different from a position matched with the heat-generating electronic component 22a, and test points 32 for testing the heat-generating electronic component 22a and low-heat-generating electronic component 22b are formed in a concentrated manner in regions RAL and RBL including the position matched with the heat-generating electronic component 22a on the lower surface of the circuit substrate 30. Consequently, heat generated by the heat-generating electronic component 22a is efficiently dissipated from a heat sink 40 via TP wiring 34, the test points 32, and a silicon adhesive 48, thereby suppressing rises in the temperature of the heat-generating electronic component 22a and low-heat-generating electronic component 22b. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
