发明名称 |
SLURRY FOR SLICING SILICON INGOT AND METHOD FOR SLICING SILICON INGOT USING THE SAME |
摘要 |
The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.
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申请公布号 |
US2010037880(A1) |
申请公布日期 |
2010.02.18 |
申请号 |
US20090441467 |
申请日期 |
2009.03.16 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
KAWASAKI TAKAFUMI;MIMURA SEIICHI;NISHIDA HIROKAZU;YOSHIDA YASUHIRO |
分类号 |
B28D5/04;B28D1/06;C09K3/14 |
主分类号 |
B28D5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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