| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent wire short-circuitting with a semiconductor chip in a semiconductor device. <P>SOLUTION: A second semiconductor chip 2 is mounted on a first semiconductor chip 1 such that a distance between an end of the upper stage second semiconductor chip 2 and an end of the lower stage first semiconductor chip 1 is longer than that between the end of the first semiconductor chip 1 and a bonding lead 7c of a wiring board 7. Further, by permitting a plurality of second wires 3b connected with the second semiconductor chip 2 to be formed by a reverse bonding system, a second wire 3b can steeply rise outside the first semiconductor chip 1 for connection, so that there can be provided clearance greatly between the end of the first semiconductor chip 1 and the second wire 3b, preventing the lower stage side first semiconductor chip 1 and the second wire 3b from being short-circuitted. <P>COPYRIGHT: (C)2010,JPO&INPIT |
