| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve a heat radiation performance while securing reliability. <P>SOLUTION: The first heat dissipation plate 26 of a relative small linear expansion coefficient is bonded with the back surface of a circuit board 22, the second heat dissipation plate 28 of a relatively large linear expansion coefficient comprising the same lead frame 23 as a lead terminal 24 is surface-bonded at the end part evading the center part of the first heat dissipation plate 26, and the distal end part 28b is exposed from a package side face to the outside. Thus, the linear expansion coefficient of the first heat dissipation plate 26 bonded with the circuit board 22 is brought closer to the linear expansion coefficient of the circuit board 22, the influence of heat stress between the circuit board 22 and the first heat dissipation plate 26 is reduced, and the generated heat of electronic components 21a, 21b and 21c is radiated from the heat dissipation plate 28 of the same material as the lead terminal 24 through the circuit board 22 and the first heat dissipation plate 26. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
