发明名称 ADHESIVE FILM, AND METAL FOIL WITH RESIN
摘要 PROBLEM TO BE SOLVED: To provide an adhesive film having excellent crack resistance and breakage resistance, and performances required for uses such as the multilayer wiring boards, and to provide a metal foil with a resin. SOLUTION: The adhesive film comprises: (a) a polyamideimide resin; (b) an epoxy resin; and (c) a phenoxy resin as essential components, wherein the content of the (c) phenoxy resin component in the adhesive film is 5-30 mass%. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010037489(A) 申请公布日期 2010.02.18
申请号 JP20080204557 申请日期 2008.08.07
申请人 HITACHI CHEM CO LTD 发明人 YAMAGUCHI MAKI;TAKEUCHI KAZUMASA
分类号 C09J179/08;B32B15/088;B32B15/092;C08G73/14;C09J7/00;C09J7/02;C09J163/00;C09J171/10 主分类号 C09J179/08
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