| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a base for a semiconductor element, an aggregate board thereof, and a semiconductor device, capable of preventing breakage at the semiconductor element and the base by reducing the stress caused by the heat generated, when mounting on a printed circuit board, as well as, operating the semiconductor element. Ž<P>SOLUTION: There are provided a first lead frame 1 exposed to a first main surface, a second lead frame 2 exposed on a second main surface, a jointing projection 4 for electrically connecting the first lead frame 1 and the second lead frame 2, and a resin 3, which fills a gap between the first lead frame 1 and the second lead frame 2, while separating them from each other. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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