发明名称 LID FOR PACKAGE SEALING AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a lid for package sealing, which improves sealing characteristics and hardly causes flow-in to a case during sealing and a creep-up phenomenon. Ž<P>SOLUTION: In the lid for package sealing for which a brazing filler material in a frame shape is fused to a lid body, an Au-plated layer in the frame shape having a prescribed width along four sides on the inner side of the brazing filler material and an Ni alloy layer containing Au for 3 wt.% or less at the opening part of the Au-plated layer in the frame shape are provided. The surface roughness of the Ni alloy layer is 0.01-0.20 μm by the surface roughness stipulated by JIS B0601. For the lid, it is preferable that the side face and back surface of the lid body are also covered with the Ni alloy layer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010040585(A) 申请公布日期 2010.02.18
申请号 JP20080198658 申请日期 2008.07.31
申请人 TANAKA HOLDINGS KK 发明人 IRIBE TSUYOSHI;IWATANI TAKUNARI;MIYAZAKI KENICHI;SHIMADA TOMOHIRO
分类号 H01L23/02 主分类号 H01L23/02
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