发明名称 MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE
摘要 The invention relates to a miniature microwave package comprising a microwave chip (60) having an active face (62). The chip includes a protective lid (72) fixed to the active face, at least partially covering it, the lid including at least one recess forming, with the active face of the chip, a cavity (94, 96, 98). The invention is used in miniature microwave packages.
申请公布号 US2010038776(A1) 申请公布日期 2010.02.18
申请号 US20050722329 申请日期 2005.12.07
申请人 UNITED MONOLITHIC SEMICONDUCTORS S.A.S. 发明人 BESSEMOULIN ALEXANDRE
分类号 H01L23/04;H01L21/50 主分类号 H01L23/04
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