| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide plating equipment for a TAB tape which is an object to be plated in which made it possible to surely apply the conductor plating having a uniform thickness on the TAB tape, and to provide a method for manufacturing the TAB tape. Ž<P>SOLUTION: The plating equipment comprising: a plating water tank 2 which holds a plating liquid 1; partitions 3 which segment the plating water tank 2 into an upper compartment 2-1 and a lower compartment 2-2 such that the plating liquid 1 can flow from the upper compartment 2-1 to the lower compartment 2-2 only through an aperture 7; a plating liquid supply section 5 which supplies the plating liquid 1 through the aperture 7 from the upper compartment 2-1 to the lower compartment 2-2; the support 6 which supports the TAB tape 10 horizontally within the lower compartment 2-2 in such a manner that the plating liquid 1 flowing down through the aperture 7 to the lower compartment 2-2 is contacted with the surface of the TAB tape 10, and a plating liquid discharge section 4 which is disposed in the lower compartment 2-2 so as to discharge the plating liquid 1. and the method for plating the TAB tape by the plating equipment are provided. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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