发明名称 Method of forming a resin cover lens of LED assembly
摘要 A method of forming the resin cover lens of LED assembly uses transparent materials, such as plastics, PP (Polypropylene), PET (Polyethylene teraphthalate), PC (Polycarbonate), PE (Polyethylene) or glass to produce the mold for making lens; and uses liquid transparent resin that can be quickly cured under EB (electron-beam) radiation, such as PU (Polyurethane), epoxy, silicon, acrylic resin or its copolymer et al., or the above resin added with photo initiator and curable under UV radiation; and fills in the mold cavity with the resin; and selects EB or UV to cure the liquid transparent resin inside the cavity to form lens. The new process in the invention is to reduce the curing time for making lens that helps LED assembly achieve high throughput rate and mass production.
申请公布号 US2010041169(A1) 申请公布日期 2010.02.18
申请号 US20070003657 申请日期 2007.12.28
申请人 LEE HWANG-PAO 发明人 LEE HWANG-PAO
分类号 H01L33/00 主分类号 H01L33/00
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