发明名称 |
METHOD FOR ADHESION OF RESIN MATERIAL COMPRISING OXYMETHYLENE POLYMER, AND STRUCTURE |
摘要 |
Provided are a method of bonding resin materials for bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), and a structure obtained by the bonding method. The method includes the steps of: preparing as the resin material (Y) an oxymethylene-based polymer composition (B) satisfying the following conditions (1) and (2); or preparing as the resin material (Y) the resin material (X) or another resin material and providing the oxymethylene-based polymer composition (B) between the resin material (Y) and the resin material (X); and heating the resin materials: (1) the oxymethylene-based polymer composition (B) has a melting point lower than that of the oxymethylene-based polymer (A), and a difference in melting point between the composition and the polymer is smaller than 5° C.; and (2) 50% or more of a peak area determined from a peak showing the molten state of the oxymethylene-based polymer composition (B) measured by DSC is present in a temperature region lower than the peak temperature of the oxymethylene-based polymer (A) by 5° C. or more.
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申请公布号 |
US2010041854(A1) |
申请公布日期 |
2010.02.18 |
申请号 |
US20070517472 |
申请日期 |
2007.12.03 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
OKAMURA AKIRA;NAGAI SATOSHI |
分类号 |
B32B37/06;B32B38/00;C08G16/02 |
主分类号 |
B32B37/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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