发明名称 METHOD FOR ADHESION OF RESIN MATERIAL COMPRISING OXYMETHYLENE POLYMER, AND STRUCTURE
摘要 Provided are a method of bonding resin materials for bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), and a structure obtained by the bonding method. The method includes the steps of: preparing as the resin material (Y) an oxymethylene-based polymer composition (B) satisfying the following conditions (1) and (2); or preparing as the resin material (Y) the resin material (X) or another resin material and providing the oxymethylene-based polymer composition (B) between the resin material (Y) and the resin material (X); and heating the resin materials: (1) the oxymethylene-based polymer composition (B) has a melting point lower than that of the oxymethylene-based polymer (A), and a difference in melting point between the composition and the polymer is smaller than 5° C.; and (2) 50% or more of a peak area determined from a peak showing the molten state of the oxymethylene-based polymer composition (B) measured by DSC is present in a temperature region lower than the peak temperature of the oxymethylene-based polymer (A) by 5° C. or more.
申请公布号 US2010041854(A1) 申请公布日期 2010.02.18
申请号 US20070517472 申请日期 2007.12.03
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 OKAMURA AKIRA;NAGAI SATOSHI
分类号 B32B37/06;B32B38/00;C08G16/02 主分类号 B32B37/06
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