| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a semiconductor device mounted with a semiconductor element on a wiring board with high reliability; and a method of manufacturing the same. <P>SOLUTION: This semiconductor device includes a printed wiring board 11 and conductor posts 510. The printed wiring board 11 includes an insulating board 101, conductor patterns 111, 112, and through-holes 101a. Each conductor post 510 includes a flange part 513 having an outer diameter larger than that of the through-hole 101a, a head part 511 projecting from a first surface of the flange part 513, and a leg part 512 projecting from a second surface of the flange part 513. An electronic component is connected to the leg parts 512. The head part 511 is inserted until the first surface of the flange part 513 contacts the undersurface of the printed wiring board 11, and electrically connected by the inner wall of the through-hole 101a. <P>COPYRIGHT: (C)2010,JPO&INPIT |
